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Packaging is the final step in the process for manufacturing a semiconductor device. A critical tool for packing is the die bonder, which facilitates device assembly typically by attaching a chip in a...
A method for representation of 3D VR by combination of 2D and 3D models is. It improves the process of 3D scene building by importing of models from TLS point cloud data and it is supposed to be an ef...
In this paper we present a framework for the rendering of dynamic 3D virtual environments which can be integrated in the development of videogames. It includes methods to manage sounds and particle ef...
The research described in this paper reports on the design, rationale, development and implementation of a set of new geospatial interfaces that combine multi-touch interaction, portable virtual envir...
A novel FDTD-based virtual electromagnetic compatibility tool for the prediction of electromagnetic emissions from a multilayer printed circuit board is introduced. Tests are performed with characteri...
期刊信息 篇名 First-principles study of electron-phonon coupling in hole- and electron-doped diamonds in the virtual crystal approximation 语种 英文 撰写或编译 撰写 作者 马琰铭,John S. Tse,等人 第一作者单位 吉林大学超硬材料国家重点实验室 刊物名称 Ph...

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